Quality
Control
Hendatronic
QC Department
Third-party
Detection Institution
Visual Inspection
Visual Inspection usually refers to the inspection of the appearance, markings, and pads of the chip package to ensure the quality and reliability of the chip package.
Functional Testing
Functional Testing refers to the testing of each functional unit of the chip to ensure that the chip's functions and performance meet the design requirements.
X-ray Inspection
X-ray Inspection is a non-destructive testing method that uses X-ray radiation to test the chip. This testing method can detect the quality and reliability of the chip by inspecting the solder joints, wire bonding, and other internal connections. X-ray Inspection can also be used to check whether the chip's packaging and structure meet the design requirements, as well as to detect any defects and abnormalities.
We have our own Quality Control (QC) department, as well as several third-party detection institutions that we cooperate with. These institutions provide services such as Visual Inspection, Functional Testing, X-Ray Inspection, Die Decapsulation and among others.
Die Decapsulation
Die Decapsulation refers to the removal of the chip packaging material by chemical etching or other methods, in order to observe and test the internal structure of the chip. This testing method is usually used to detect the internal structure, wire bonding, and other details of the chip to ensure its normal operation and reliability.
Outside Package Inspection
Outside Package Inspection refers to visually inspecting to examine the appearance of the chip, to check for damage, wear, corrosion, and other issues. This is one of the most basic testing methods in chip testing and can be used to initially determine the quality and reliability of the chip.
Electron Microscope Inspection
Electron Microscope Inspection refers to using an electron microscope to observe and test the chip, in order to detect the microstructure and material characteristics inside the chip. The electron microscope has a high magnification and resolution, allowing for the detection of small material defects, structural abnormalities, and performance issues. This testing method is often used to detect the crystal structure, circuit connections, metal structure, and packaging materials inside the chip, to ensure its normal operation and reliability.
